Indium Corporation Features Gold Alloy Solder Preforms at SPIE Photonics West

Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability joining and sealing. AuSn preforms are designed for high-reliability applications, such as laser, photonics, microwave systems, medical, and aerospace.

Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making them compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.

Semiconductor-grade AuSn preforms are designed specially to meet the challenges facing RF and power semiconductor devices as they continue to get smaller, with increasing power density and power ratings.

Indium Corporation’s Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs. The Gold Preform Quick Turn Program offers engineering support from design to production and a quick turnaround for new design, tool, or prototype quantities.

For more information about Indium Corporation’s gold alloy solder preforms, visit us at booth #3310 or go to www.indium.com/gold.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.facebook.com/indium or @IndiumCorp.