The following technical papers from Indium Corporation experts will be featured:
- Novel TIM Solution with Chain Network Solder Composite by Dr. Ning-Cheng Lee, Vice President of Technology
- Enhanced Cleanability Using Fluxes with Decreased Viscosity After Reflow by Dr. Lee
- Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA? by Kim Flanagan, Technical Support Engineer
- Optimizing the Robotic Soldering Process by Robert McKerrow, Product Specialist
Additionally, Claire Hotvedt, Product Development Specialist, will present her poster, Durafuse™ LT–A Mixed Alloy Solution for Low-Temperature Drop Shock.
Miloš Lazić, Technical Support Engineer, will moderate the technical conference session S05: Advances in Dispensing.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.