Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany.

At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.

As the Regional Technical Manager for Germany, Austria, and Switzerland, Karch provides support to Indium Corporation’s customers in those regions, including sharing process knowledge and making product recommendations. He has more than 20 years of automotive industry experience, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer, has a Six Sigma Yellow Belt, and was selected by the Austrian Patent Office as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly.

For more information about our experts’ recent work, visit www.indium.com/techlibrary or visit our booth at the show.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.