Indium Corporation’s Jonathan Minter, Research and Development Metallurgy Technician, will present at the TMS 2018 Annual Meeting & Exhibition on March 11-15 in Phoenix, Ariz.

High-Pb solders have been used as die-attach materials for decades in discrete power packages. Due to the known harmful effects of Pb to human health and the environment, and the demand of SiC power device serving under higher junction temperature, alternative Pb-free materials have been studied intensively. However, Pb-free alternatives for die-attach applications are still in the infant age, and no well-recognized drop-in solution is available yet.

Minter’s presentation, High Temperature Lead-free Die Attach Materials, will review the potential materials/technologies for high-temperature Pb-free die-attach, including solders, sintering materials, and solid-liquid interdiffusion materials/technology.

Minter joined Indium Corporation in 2015 and is responsible for supporting the development and testing of high-temperature Pb-free solder paste alloys. He earned a bachelor’s degree in chemistry and a master’s degree in chemistry (adolescence education) from SUNY Cortland.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.