Indium Corporation Announces SMTA China East Presentations

Three of Indium Corporation’s experts will share their industry knowledge and insight during SMTA China East Technology Conference, April 21-22 in Shanghai, China. This event is held in conjunction with NEPCON China 2021 at the Shanghai World Expo Exhibition & Convention Centre.

The demand for faster, more powerful devices in the electronics industry makes thermal management a high priority as the need for improved high-performance materials continues to grow. While common thermal interface material (TIM) solutions – such as thermal grease, thermal gel, solder preforms, and liquid solder – have their own benefits, they can also be subject to common reliability issues, including outgassing, voiding, and pump-out.

In Versatile TIM Solution with Chain Network Solder Composite, Dr. Sophia Bu, research scientist, will examine the development of a novel TIM solution with a high-melting Cu chain network that prevents these defects. Dr. Bu’s major field of research at Indium Corporation is thermal materials, fluxes, and solder paste technology. She earned her Ph.D. in chemistry at Fudan University in 2011.

Bottom termination components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC).

In his presentation: Minimizing Voiding in QFN Packages Using Solder Preforms, Leon Rao, senior technical support engineer, will discuss how voids form in QFNs and how to minimize them. He’ll also cover factors that affect voiding, such as stencil design, stencil thickness, reflow profile, solder paste particle size, and solder pastes. The use of solder preforms to minimize voiding will also be presented.

Rao provides comprehensive technical advice to Indium Corporation’s customers in the Shanghai and Hangzhou areas. This includes customer guidance in the selection, use, and application of Indium Corporation’s entire range of products. Rao earned his bachelor’s degree in applied physics at the Jingdezhen Ceramic Institute.

Low-temperature solders with peak reflow temperatures of 200°C and below have been extensively studied, with a leading Bi-containing candidate offering a peak reflow range as low as 165-170°C. The brittleness found in Bi-containing solders, however, delivers poor drop shock performance and compromised reliability.

In An Alternative Lead-Free, Low-Temperature Solder with Excellent Drop Shock Resistance, Anson Yu, technical manager for Global Accounts in Asia, will examine the benefits of Indium Corporation’s Durafuse™ LT, an innovative low-temperature alloy technology that offers enhanced reliability with drop shock performance two magnitudes better than Bi-containing solders.

Yu is responsible for coordinating and managing technical service and resources to multinational accounts in Asia. He has more than 10 years of manufacturing and equipment engineering experience. Yu earned his bachelor’s degree in electrical engineering at the Nanjing Institute of Technology and his master’s degree in business administration at Wuhan University.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

About SMTA China East Technology Conference

SMTA China East Technology Conference, held in conjunction with NEPCON China 2021, will address the industry’s most pressing issues in Advanced Packaging/Components, Assembly Business/Supply Chain, Emerging Technologies, Harsh Environment Applications, PCB Technology, Process Control, and Soldering Processes.