Future Electronics Presents Designing for Resilience at Embedded World Exhibition and Conference 2023

Pointe Claire, Quebec, Canada– Future Electronics, a leading global distributor of electronic components, was present at the Embedded World Exhibition and Conference 2023 in Nurenburg, Germany. Embedded World is a worldwide platform for the embedded community where leaders, key players, and industry associations come to meet. The conference took place from March 14 to 19 in Nurenburg, Germany.

At the Future Electronics booth, the Centre of Excellence team of engineers showcased the concept of designing for resilience. By using the Open Standard Module (OSM) footprint, which comes in four different sizes, customers can realize design scalability in either direction and ensure a smooth production cycle.

The Centre of Excellence’s evaluation board, which was shown at Embedded World, is available to all through Future Electronics at https://www.my-boardclub.com/. This unique platform encompasses all forms of connectivity necessary for industrial applications.

“We have seen lots of interest from customers who want to simplify their design and ensure their supply chain is as robust and resilient as it can be. Our Centre of Excellence evaluation board can easily give an engineer a route to this concept,” said Pawel Kaczynski, Manager of the Centre of Excellence in Gdańsk.

Future Electronics is pleased to have been a participant at Embedded World 2023, and the team looks forward to continuing to connect with industry colleagues from around the world at various conferences and trade shows throughout the year.