Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal is literally all around us.
Indium metal, specifically foil made of pure indium, InSn, InAg, and pure indium clad with aluminum, efficiently removes process heat, making it a preferred choice for burn-in and test.
Since pure indium is more likely to stick to the burn-in head, a very thin cladding of aluminum is used to reduce the sticking. It is much more expensive to test at the board level—after the components have been soldered to the board—than to test each individual chip.
Indium Corporation’s Heat-Spring® thermal interface material (TIM) is designed to be used as an interface between a heat source and a heat-sink, heat-spreader, or heat-pipe. The malleability of indium metal maximizes the Heat-Spring’s thermal resistance and enhances cooling.
For more information on indium metal, visit www.indium.com/indium49.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.