‘Driving Manufacturing Forward’ at SMTconnect 2024 in Nuremberg, Germany June 11-13

 

Delvitech will meet you at Stand 4A-127.

Delvitech designs, manufactures and supplies a sustainable AI based technological solution for the 3D automated optical inspection of assembled printed circuit boards. In Delvitech R&D and Innovation are at the heart of every activity. Artificial intelligence is combined with an industry-leading engineering technology, resulting in a unique inspection machine for all SMT and THT production phases.

Characterized by self-programming features, Delvitech’s software, in conjunction with its proprietary patented multi-camera optical head, precision-engineered in Switzerland, delivers unparalleled inspection capabilities. The web-based software is unique, modern, singular and its ultimate goal is to automatically generate inspection programs, that can even be shared through the cloud.

The result is the continuous improvement of the entire manufacturing process, making it faster, steadier, more scalable. Delvitech solution means less errors, less waste, less CO2, more future.

Solder Chemistry to Participate in the Fraunhofer Future Packaging Production Line at SMTconnect

Solder Chemistry, a trusted brand for over 30 years now powered by Indium Corporation, will feature its complete suite of services for PCBA as part of the prestigious Fraunhofer Future Packaging Production Line exhibition at SMTconnect, June 11-13, in Nuremberg, Germany. Celebrating its 30^th anniversary in 2024, Solder Chemistry is committed to maintaining its flexible, customer-oriented structure to deliver the same quality, innovation, and customer satisfaction for which it has become renowned.

Organized by the Fraunhofer IZM, the live production line is an industry-renowned collaboration among various equipment manufacturers, material providers, component suppliers, and research institutes. Inaugurated in 1997, the 26^th edition of the joint effort will examine how a higher degree of digitalization and automation can make production processes more robust and responsive to disruptions and external influences.

Solder Chemistry’s BLF083, a lead-free, no-clean paste designed for excellent soldering results with a wide range of process conditions, will be featured on the Future Packaging production line. BLF083 offers outstanding low-voiding, slump, and solder beading resistance, as well as high-temperature stability, long-term processing and standing time. BLF083 paste delivers:

• Low-voiding performance
• Excellent low-to medium-speed printing
• High tackiness
• Good response-to-pause
• Low beading
• Clear residue
• Easy cleanability

“It is an honor for Solder Chemistry’s BLF083 to be featured on the Fraunhofer line at SMTconnect,” said Werner Wagner, General Manager Indium Advanced Materials GmbH.

“The line is a highlight of the show and provides an invaluable opportunity for attendees to interact with cutting-edge manufacturing processes and technologies in a simulated real-world environment.”

Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225

Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse. The following offers a glimpse into what Koh Young will present at the tradeshow:

Solder Paste Inspection (SPI)

In 2002, we introduced the concept of 3D measurement-based solder paste inspection, revolutionizing the industry. Today, manufacturers recognize the value of 3D measurement data, utilizing it to enhance the print process, thus improving production yield and quality. 3D SPI has now become a standard requirement for SMT lines, no longer optional. The KY8030-2 serves as our SPI workhorse, the most popular SPI solution in the electronics manufacturing market. Featuring patented dual-projection technology, we provide reliable measurement data, enabling manufacturers to optimize the print process effectively.

Automated Optical Inspection (AOI)

The Koh Young 3D AOI Zenith Alpha HS+ represents a True 3D inspection solution powered by artificial intelligence and machine learning, combining top-notch mechatronics and algorithm technologies to deliver outstanding performance without compromising accuracy. In the realm of 2D and hybrid 3D inspection, false calls and escapes often result from inferior inspection technologies. To address this, we adopted a distinct approach, basing our AOI on full 3D measurement technology. Our solution does not stem from a 2D inspection methodology; it was conceived from the outset to provide unmatched inspection capabilities, eliminating false calls and field escapes. At Koh Young, the Zenith measures all components in True 3D, assessing the component body based on genuine 3D profilometric information. This approach ensures dependable inspection results, irrespective of component or board color variations. When combined with our AI engine and machine learning algorithms, our 3D measurement data enables manufacturers to benefit from autonomous processes and automated programs, including smart review, aiding operators in identifying issues accurately.

Smart Factory Solutions

AI-powered KSMART solutions facilitate process control automation, emphasizing data management, analysis, and optimization. It gathers data from across the factory for defect detection, real-time optimization, informed decisions, and traceability, enhancing production, elevating quality, and reducing costs by eliminating variances, false calls, and escapes.

To discover how our solutions can enhance your quality, visit SmartRep and us at SMTconnect in booth Hall 4A 225 at NürnbergMesse from June 11-13, 2024. If you’re unable to attend the show, you can still explore more about our best-in-class inspection solutions at www.kohyoung.com.

Visit Mycronic at Hall4A235

Mycronic is a global supplier of high precision production equipment, and together with our customers we are committed to extending the frontiers of electronics technology. Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process.

 

SAKI is showcasing its unique range of automated inspection solutions (SPI, AOI and AXI) alongside some innovative software feature highlights

As a key highlight of the Selecs booth #235 in Hall 4, Saki will be showcasing its unique range of automated inspection solutions including the award-winning X-ray Automated Inspection System (AXI) and innovative ‘One Programming’ and AI Solutions Features.

Saki Link  – Saki Link is a unique feature that enables real-time control and management of all Saki inspection systems in the SMT line from one location, linking inspection results and providing predictive inspection coverage for the whole inspection process. With direct communication between related Saki inspection systems, handling complex inspection machinery and optimizing throughput across the SMT line is substantially simplified.

One Programming  – Saki’s One Programming feature is the next step in implementing Saki’s unique “One Software & One Hardware” platform philosophy. One Programming allows for a one-step programming operation to generate and build inspection programs/recipes for subsequent inspection processes. This approach significantly reduces the time required to prepare inspection setups for new products and assures perfect inspection coverage.

AI Solutions  – an introduction to Saki’s unique integration of AI functionality.