Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
BANNOCKBURN, Ill., USA — Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC’s work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
Dr. Iyer comes to IPC after serving as senior vice president, power products business and technology R&D at Amkor Technology Inc. Before that, he spent 13 years as a corporate vice president at Texas Instruments. He was also previously at Infineon Technologies and several microelectronics research institutes. He has earned 24 patents and has authored or co-authored more than 150 technical articles.
“We are so pleased that Devan Iyer has joined Team IPC,” said IPC Chief Technology Officer Matt Kelly. “The future of advanced packaging directly affects the future of all aspects of electronics manufacturing. With Devan’s help, IPC will continue to be the leading advocate of a ‘silicon-to-systems’ approach, recognizing the importance of silicon fabrication as well as related capabilities such as advanced packaging, printed circuit boards (PCBs), and IC substrates.”
“We are thrilled to have Dr. Iyer join the IPC team,” said IPC President and CEO, Dr. John W. Mitchell. “Adding his capabilities to our organization further cements IPC’s role as the leading industry association for advanced packaging.”
Governments in North America and Europe are actively ramping up their support of advanced packaging via several policies and programs. For example, the CHIPS for America R&D Office recently issued a Notice of Funding Opportunity (NOFO) for research and development activities that will help expand domestic capacity for advanced packaging substrates and substrate materials. IPC seeks to play an active role in this program.
Meanwhile, the European Commission has also identified microelectronics and advanced packaging as areas requiring further government focus and support.
IPC’s influential 2021 report, North American Advanced Packaging Ecosystem Gap Assessment, found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion’s share of capabilities and capacity. That report was referenced in the CHIPS Office’s guiding strategy document for the National Advanced Packaging Manufacturing Program. An IPC Symposium on Advanced Packaging in 2022 also helped propel government action.
For more information, visit Advanced Packaging Semiconductors | IPC Industry Initiatives.
