CyberOptics Demonstrates New MRS-Enabled 3D AOI, SPI and CMM Systems at APEX

Minneapolis, Minnesota — January 2018 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, today announced plans to exhibit in Booth #2409 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 – March 1, 2018 at the San Diego Convention Center, California. Company representatives will demonstrate the new high-speed SQ3000™3D CMM, an extension of the MRS-enabled SQ3000 platform deemed best-in-class, the new SE3000™ SPI system and QX250i™ double-sided AOI system.

The new SQ3000 3D CMM (Coordinate Measurement) system, powered by Multi-Reflection Suppression (MRS) technology utilizes CyberCMM™, a new comprehensive software suite for coordinate measurement. In a lab or production environment, the MRS-enabled SQ3000 CMM system is extremely fast and highly accurate, with repeatable and reproducible measurements for metrology applications in manufacturing of a wide variety of products such as PCBs, semiconductors and consumer electronics.

CyberCMM™, an extensive suite of CMM tools, provides 100 percent metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y, to name a few. A fast and easy setup can be performed as compared to a slow, engineering resource-intensive setup that typically requires multiple adjustments with traditional CMMs.

The new SE3000™ SPI system is the very first SPI system to incorporate the industry-leading MRS sensor technology with a finer resolution for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits. Combined with the award-winning, easy-to-use software, solder paste inspection has reached a new level of precision for the most stringent requirements.

Also on display, the QX250i™ simultaneous double-sided AOI system offers fast, flexible and high performance inspection for all applications, and is ideally suited for pre-reflow and selective solder inspection. The top and bottom high-resolution Strobed Inspection Modules (SIMs) with enhanced illumination provide a single platform for the inspection and defect review process that shortens the production line and drives approximately 50 percent productivity improvement.

For more information, visit www.cyberoptics.com.