Michael Ford always has the answer, and this time, Eric asks the most profound of questions: what does the end state of Industry 4.0 really look like, and how close are we to achieving that? Michael offers his thoughtful...
Juan updates Eric on how 2020 is shaping up for Koh Young Americas. “Last time we had an election year in the U.S., I told Dr. Koh to prepare for a slower second half, and that year we had the best year we ever had. Dr Koh...
Eric speaks with Chris Bastecki, Director, Indium Corporation, about all things solder related. Indium’s strategy is to be at the heart of emerging technologies to develop solutions that address the real challenges faced...
Philip Stoten interviews Martin Kostadinov, Saki Europe GmbH. They discuss trends in Smart Manufacturing, including supplier collaboration to benefit customer’s efforts to convert data to business intelligence. Martin also...
With connectivity so central to Industry 4.0 and smart factory, it’s good to see people and companies connecting too. In this interview with ASM Assembly Systems’ Director Product Management SW-Integration Platform, ...
With trends like 5G and low temperature soldering on the agenda, Ross Berntson, President and COO of Indium Corporation sits down with SCOOP’s Philip Stoten during Productronica 2019. Filmed on location in the SCOOPstudio...
SCOOP’s Philip Stoten is joined by Larry Marcanti from the High Density Packaging User Group to explain a little about the organization and the work they do. Driven by OEMs, this group has operated for 25 years with a wide...
Eric got to APEX early and marvels at how the booths get put together in so short a time. He wanted to share his awe. Also, if you are at the show, stop by EMSNOW’s booth 3013 to say ‘hi’.
Garrett Wong, Senior Product Manager, Nordson ASYMTEK joins SCOOP’s Philip Stoten to chat about their latest development and the trends driving their dispensing and coating solutions. Filmed on location in the SCOOPstudio...
Eric Miscoll and Andy Mackie of Indium discuss the challenges of electronics in automotive applications, especially the extended mission profile. Indium is developing new solder formulations and new processes to address these...
