High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to...
- Thomas Tattersall, Executive VP and COO, MicroCare at SMT Hybrid Packaging 2018
- Marco van Oosterhout, Director Product Marketing, Kulicke & Soffa at SMT Hybrid Packaging 2018
- Manuel Schöllig, International Account Manager, Emil Otto at SMT Hybrid Packaging 2018
- Thomas Marktscheffel, Director Product Management, ASM Assembly Systems at SMT Hybrid Packaging 2018
- David Bergman, Vice President International Relations at IPC at at SMT Hybrid Packaging 2018