Call for Papers: EIPC Winter Conference, Milan, Italy February 14-15, 2019
The European Institute for the PCB Community (EIPC) issued a call for papers for its Winter Conference Feb. 14-15 in Milan, Italy.
Conference location: NH Hotel Milano Fiera, Italy
Bonus Programme: Visit to Elga Europe
EIPC Winter Conference Milan 2019
“European Technology for the global PCB/Electronics Industry”
Presentations on the following topics can be included in the conference programme:
Keynote / Trends
-Business Outlook: Global Electronics Industry
-Automotive, E-mobility and High Rel application, Radar High Frequence
-Industrial Electronics, Lighting Transportation, Metal Core PCB, Space, Avionics-G5, Medical
Reliability /traceability requirements by Application Tools for Reliability
-Responsibility for Product Reliability and Safety -What Testing is needed and how to
-Standards for Product Safety and Reliability measure Reliability
-Inhouse process control and conformation Testing -How to ensure product Safety and
-Material and finish product Safety and Testing Reliability
-Advanced supply chain and Third party Testing
Design & New Technologies
Success through Evolution- or Disruptive Technologies?
-PCBs in Polymer Technology
-Printed Electronics
-Material Technology- Laminate technologies – Coating technologies
Equipment evolution to meet Technology challenges
-Automation
-HMLV High Mix Low Volume
-Imaging and Printing
-ML-Pressing
-Controlled line etching, Copper thickness tolerances
-Embedding and Metal Core PCBs
-New technology, Innovations and Invention
Roadmapping on Automotive, Radar, Trains, Avionics, Lightening
-What input is provided through “Roadmap by market segments”
-Technology Guidance through market needs
-Adapting processes, materials, chemistry, equipments to future technology needs
-Strategic Partnership and planning for success through Networking
