February, 2018 — The best technical conference paper of IPC APEX EXPO® 2018 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 27.
Taking top honors, the winning paper is, “Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils” by Marina Y. Koledintseva, Oracle. Her co-author was: Tracey Vincent, CST of America. This paper will be presented during Technical Conference Session 16 (PCB Signal Integrity/ High Speed/ High Frequency) on Wednesday, February 28.
This year, two papers were selected in the honorable mention category. Honorable mention went to, “Derivation of Equation on Thermal Life Prediction of Plated Through Hole for Printed Wiring Board” by Yoshiyuki Hiroshima, Fujitsu Advanced Technologies Limited. His co-authors were: Shunichi Kikuchi and Akiko Matsui, Fujitsu Advanced Technologies Limited; Yoshiharu Kariya and Kazuki Watanabe, Shibaura Institute of Technology; Hiroshi Shimizu, Hitachi Chemical Company, Ltd.; and Jack Tan, HDP User Group International, Inc. This paper will be presented during Technical Conference Session 12 (PCB Reliability) on Wednesday, February 28.
Honorable mention also goes to “Bottom Heating during Manual Rework” by Lars Bruno, Ericsson AB. This paper will be presented during Technical Conference Session 20 (Rework) on Wednesday, February 28.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place including standards development committee meetings, professional development courses, the exhibition and more, visit www.IPCAPEXEXPO.org.