Alpha to Present on Flexible Printed and Hybrid Electronics at 2018FLEX

Alpha Assembly Solutions, a global supplier of innovative electronic assembly materials, is presenting at the upcoming 2018FLEX Conference taking place from February 12^th-15^th in Monterey, California.

Rahul Raut, Director of Strategy & Technology Acquisition for Alpha, will present a technical paper on the Development of a Fully Integrated, Compatible, Materials Stack for Flexible Printed Electronics. Mr. Raut will present a holistic view of the materials aspect for the Printed Electronics Ecosystem, and specifically highlight FPE building blocks being developed from an integrated perspective.

Bawa Singh, Alpha’s Executive Vice President of Technology, will present on Novel Low Temperature Materials as Key Enablers of Flexible Hybrid Electronics. Dr. Singh will explore the challenges and limitations of current generation Flexible Hybrid Electronics and present the use of novel low temperature solders and high reliability alloys to address the incumbent’s shortcomings for assembly of a wide array of flexible substrates and low temperature components.

Both Mr. Raut and Dr. Singh have been leading the product innovation and development efforts at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions group of businesses, to bring leading edge, next generation materials and processing technologies that enable flexible and high reliability products in emerging sectors of the electronics industry.