Somerset, NJ – Alpha Assembly Solutions, a provider of electronic soldering and bonding materials, has completed two successful customer seminars in partnership with PreventPCB in Italy, highlighting its commitment to customer training and education.
The seminars, which were held in Turin and Florence in Italy during March and May respectively, focused on key topics including Industry 4.0, process and product reliability, the latest developments in low temperature soldering technology and the benefits of using solder preforms in electronics assembly. Alpha’s technical experts discussed Alpha’s new low temperature solder paste, ALPHA® OM-550 HRL1, designed for temperature sensitive substrates, components and high warpage chips, and the new ALPHA® BTC Preforms for void reduction on bottom terminated components.
The seminars were hosted in partnership with PCB production and technology specialists, PreventPCB. Based in Vergiate, Italy, PreventPCB has over 20 years’ experience in PCB production, and can offer services such as PCB lay-up, thermal stress analysis, dielectric materials characterization, solder joint acceptability, thermal simulations and aging tests in their state-of-the-art laboratories.
Donato Casati, Sales Manager for Italy and the Balkans at Alpha Assembly Solutions, a MacDermid Performance Solutions business, comments, “The partnership with PreventPCB enables customers to learn about the latest developments and technologies in both PCB production and electronics assembly materials. The seminars also highlight Alpha’s commitment to educating and informing our customers of the latest solutions that can work to target key areas of concern in their electronics assembly process including voiding, component warpage and temperature sensitive substrates.”
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