Somerset, NJ – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature its latest Low Temperature Solder and Void Reduction Solutions technologies at the Cleveland, Ohio and Queretaro, Mexico SMTA Expos and Tech Forums taking place on July 12, 2018.
Alpha’s newest low temperature solder paste, ALPHA® OM-550, will be the focus among its Low Temperature Solder Solutions. “OM-550 continues to perform best in class in this category and provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low-temp alloys,“ said Robert Wallace, Regional Marketing Manager for the Americas.
Alpha’s Void Reduction Solutions technology combines several of Alpha’s innovative products and assembly processes. Alpha recently launched ALPHA® OM-358, a paste with ultra-low voiding properties. “This paste is a terrific addition to our arsenal of void reduction solution strategies.,“ said Paul Salerno, Global Portfolio Manager, SMT Assembly Solutions. “Customers will see an increase in process stability and thermal and electrical performance, even in the most demanding component applications. Its excellent electromitration characteristics ensure reliability and functionality of fine-pitched components.”
In addition, Alpha will also feature it’s Reclaim Services program. Helping customers throughout the Americas dispose of their solder paste debris for over 30 years, the reclaim and recycling services are an important component of Alpha’s Sustainability programs. Having the safest, most efficient, environmentally-compliant recycling solutions, Alpha takes pride that no materials are ever sent to a landfill.
For additional information about Alpha’s industry-leading products and services, please visit alphaassembly.com.