Koh Young Technology to Demo New Level of Connectivity at NEPCON China 2018
Shanghai – Under the slogan “True 3D now powered by AI Platform,” Koh Young Technology will highlight its latest connectivity KSMART Process Optimizer (KPO) for optimizing printers in booth 1B60 at NEPCON China from 24-26 April,2018. Pursuing AI-driven automation, Koh Young has been working with its KSMART partners like MPM printer line and EKRA printer line to realize machine connectivity and a zero-defect production line.
Automated Printer Optimization
Due to growing popularity for smaller, lighter, and smarter electronic devices, there has been increasing demand of ultra-fine pitch packages, such as flip chips and chip scale packages in printed circuit board assembly (PCBA), which has made stencil printing much more complicated process. In fact, over 70 percent of soldering defects are associated with the solder paste printing process. Thus, manufacturers must ensure the optimal printing parameters are consistently applied during production.
On the move to Industry 4.0
Defining the optimal process parameters often needs a high degree of expertise, as there are many environmental factors affecting the process. The KSMART Process Optimizer, a key deliverable from the collaborative projects with partner companies, overcomes this challenge by assisting real-time communication of monitoring data from the screen printing process including insufficient paste, shape deformity based on 3D volume, and more.
Real-time Process Optimization
The KSMART Process Optimizer, comprised of three interlinking software modules, supports real-time process optimization by combining real-time printing information with SPI measurement data. REal-time alerts prevent print quality problems and monitor printer hardware engagement and print ready status via Pre DOE, while automatically optimizing printer parameters. It provides real-time alarms based on printing quality during DOE through PDM Lite and verification of printing results following application of recommended parameters resulting in significant print quality improvements and increased yield.
As the absolute leader in SPI and AOI markets, Koh Young will display a broad sampling of its latest developments, as well as the company’s effort for various standard integrations, such as the Hermes Standard for open M2M communication. Koh Young will be putting up The Hermes Standard Logo on their booth and products at booth 1B60. If you cannot attend the show, you can learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com.
