IPC Releases New Video Explaining the Importance of Advanced Packagin

A new video from IPC, explains the important concept of “advanced packaging” of semiconductor chips and why it’s so important to the future of the United States and the world.  

In the past, “packaging” semiconductors meant protecting them from stresses such as heat and vibration. Today, “advanced packaging” means putting more functional chips into unified packages that boost the power and performance of the overall system. It’s been dubbed “the new king” of innovation in electronics since “Moore’s Law” – the doubling of chip capacity every two years – no longer holds.

The video is a continuation IPC’s efforts to educate government leaders and policy influencers on the need for a “silicon to systems” industrial strategy, a more holistic approach that boosts all of the sectors involved in electronics manufacturing – not just chips – to drive innovation, security, and resilience. The goals of the CHIPS and Science Act cannot be achieved without a great focus on this critical technology.