CEE-PCB Appoints Jerome Larez to Position Field Application Engineer North America

Huizhou China: Tom Yang CEO of CEE PCB has announced the appointment of industry veteran Jerome Larez to the position of Field Application Engineer (FAE) North America.

Mr. Larez has held a number of technical sales positions with printed circuit board companies. Most recently with MicroConnex corporation. He started his career in the industry with Prototron Circuits both in their Tucson and later Redmond division. His career has crossed both engineering and sales making him an ideal candidate for his new FAE position.

Mr. Yang said, “Jerome bring s a depth of technical and sales knowledge as well as a great deal of experience in the North American PCB market. His experience and energy and as well as his passion for helping customers is exactly what we are looking for as we enter the North American PCB market.”

Added Mr. Larez. I am looking forward to this new chapter in my life. The Capabilities and Technologies that CEE-PCB brings to the market is something that I was really looking for in my next company. I am very optimistic about working with CEE-PCB.”

About CEE-PCB:

Huizhou CEE Technology Inc. (Stock Code: 002579), founded in 2000, provides a one-stop service from professional R&D to sales and manufacturing. Our offerings include a comprehensive suite of products such as rigid printed circuit boards (RPCB), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F) and flexible printed circuit assembly (FPCA). With three state-of-the-art factories located in key industrial hubs, we are recognized as a key high-tech enterprise under the National Torch Program, hold the position of Vice Chairperson in the China Printed Circuit Industry Association (CPCA) and contribute as one of the industry standard setters.