More Than 300 Volunteers Honored by IPC at APEX 2018

BANNOCKBURN, Ill., USA, March, 2018 — IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

For their leadership of the D-32 subcommittee in the development of IPC-TM-650 2.6.27A, Jerry Magera, Motorola Solutions; Jim Monarchio, TTM Technologies, Inc.; and Joey Rios, Massachusetts Institute of Technology earned a Committee Leadership award. For their contributions to IPC-TM-650 2.6.27A, Lance Auer, Conductor Analysis Technologies, Inc.; Tim Estes, Conductor Analysis Technologies, Inc.; Chris Mahanna, Robisan Laboratory, Inc.; Nick Meeker, Conductor Analysis Technologies, Inc.; Wesley Moreau, Extreme Engineering Solutions, Inc.; Jeff Sonnenberg, Extreme Engineering Solutions, Inc.; and Jennet Volden, Rockwell Collins, earned a Distinguished Committee Service Award.

 

For their leadership of the 2-18K committee that developed IPC-1754, Materials and Substances Declaration for the Aerospace, Defense, Heavy Equipment and Other Industries, Walter Jager, ECD Compliance; Rick Shanks, Pratt & Whitney; and Jean-Pierre Theret, Dassault Systemes, earned a Committee Leadership award. For their significant contributions to IPC-1754, Dr. N Nagaraj, Papros Inc., and Raj Takhar, Assent Compliance Inc., earned a special recognition award. For their contributions to IPC-1754, Douglas Aylward, Raytheon; Brenda Baney, B Cubed Consulting; Dave Billings, Rolls-Royce PLC; James Calder, Assent Compliance Inc.; Cindee Cognetta, Raytheon; Francois Ducamp, Airbus SAS; Renato da Nova Favarin, Embraer S.A.; Linda Fetterman, Boeing Company; Marelle Fogel, DXC; Richard Forselius, Sikorsky Aircraft; Brenda Fukai-Allison, Boeing Company; Andy Gbur, Tetra Tech; Valerie Kuntz, Assent Compliance Inc; Chuck LePard, DXC; Manish Patel, Cummins Inc.; Mussie Pietros, Gelcore; Margaret Proul, Lockheed Martin; Timothy Sheehan, Raytheon Company; Eric Straw, Rockwell Collins; Gail Sutherland, Tetra Tech; John Wagner, Association of Equipment Manufacturers; Michael Wurzman, RSJ Technical Consulting, and Paul Ylioja, Granta Design, earned a Distinguished Committee Service Award.

 

For their leadership of the 3-11 Subcommittee that developed IPC- 4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards, Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA); and Doug Sober, Essex Technologies Group Inc., earned a Committee Leadership award. For their contributions to the revision of IPC-4101E, Steven Ethridge, Dell Inc.; Terry Fischer, Hitachi Chemical Company America, Ltd.; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Pierre-Emmanuel Goutorbe, Airbus Defence and Space; Vicka Hammill, Honeywell Inc. Air Transport Systems; Stan Hertzel, European Space Agency; Philip Henault, Raytheon Company; Doug Leys, Neltec, Inc.; Renee Michalkiewicz, NTS – Baltimore; Jim Monarchio, TTM Technologies, Inc.; Karl Sauter, Oracle America, Inc.; Bhanu Sood, NASA Goddard Space Flight Center; Chris Totten, Isola Group SARL; and Dan Welch, Rogers Corporation, earned a Distinguished Committee Service Award.

 

For their leadership of the 5-23a Printed Circuit Board Solderability Specifications Task Group that developed J-STD-003C, WAM 1& 2, Solderability Tests for Printed Boards, Gerard O’Brien, Solderability Testing and Solutions, Inc.; and Michah Pledger, Vivant, Inc., earned a Committee Leadership award. For their contributions, Martin Bayes, TE Connectivity; Scott Bowles, L-3 Fuzing and Ordnance Systems; Lenora Clark, MacDermid Enthone Electronics Solutions; Dave Hillman, Rockwell Collins; Henry Rekers, Schneider Electric; and Joey Rios, Massachusetts Institute of Technology, earned a Distinguished Committee Service Award.

 

For their leadership of the IPC Component and Wire Solderability Specification Task Group that developed EIA/IPC/JEDEC-J-STD-002E, Dennis Fritz, MacDermid Enthone Electronics Solutions; Dave Hillman, Rockwell Collins; Ife Hsu, Intel Corporation; and Douglas Romm, Texas Instruments Inc., earned a Committee Leadership Award. For their contributions to this standard, Beverley Christian, HDP User Group; James Daggett, Raytheon Company; Todd MacFadden, Bose Corporation; Graham Naisbitt, Gen3 Systems Limited; Bradley Smith, Allegro Microsystems Inc.; Donald Tyler, Corfin Industries LLC; and Vijay Kumar, Lockheed Martin Missiles and Fire Control, earned a Distinguished Committee Service Award.

 

For their leadership of 5-22a, the J-STD-001 Task Group that developed J-STD-001G, Requirements for Soldered Electrical and Electronic Assemblies, Dan Foster, Missile Defense Agency; and Kathy Johnston, Raytheon Missile Systems, earned a committee leadership award. For their leadership of 7-31b, the IPC-A-610 Task Group that developed IPC-A-610G, Acceptability of Electronic Assemblies, Robert Fornefeld, L-3 Technologies; Constantino Gonzalez, ACME Training & Consulting; and Mary Muller, Crane Aerospace & Electronics, earned a committee leadership award. For significant contributions in the development of IPC-A-610G, and J-STD-001G, Robert Cooke, NASA Johnson Space Center; Dan Foster, Missile Defense Agency; Dave Hillman, Rockwell Collins; Kathy Johnston, Raytheon Missile Systems; Joseph Kane, BAE Systems; Leo Lambert, EPTAC Corporation; Mary Muller, Crane Aerospace & Electronics; Doug Pauls, Rockwell Collins; Debbie Wade, Advanced Rework Technology-A.R.T.; and Udo Welzel, Robert Bosch GmbH, earned a special recognition award. For their contributions and efforts to either or both IPC-A-610G or J-STD-001G, Erik Bjerke, BAE Systems; James Blanche, NASA Marshall Space Flight Center; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; William Cardinal, UTC Aerospace Systems; Robert Cooke, NASA Johnson Space Center; James Daggett, Raytheon Company; Ross Dillman, ACI Technologies, Inc.; Symon Franklin, Custom Interconnect Ltd.; Dave Hillman, Rockwell Collins; Ife Hsu, Intel Corporation; Milea Kammer, Honeywell Aerospace; Joseph Kane, BAE Systems; Patrick Kane, Raytheon System Technology; Gary Latta, SAIC; Garry McGuire, NASA Marshall Space Flight Center; John Mastorides, Honeywell Aerospace; William D. May, NSWC Crane; Scott Meyer, UTC Aerospace Systems; David Mitchell, Lockheed Martin Mission Systems & Training; Gregg Owens, Jet Propulsion Laboratory; Agnes Ozarowski, BAE Systems; Helena Pasquito, EPTAC Corporation; Irene Romero, Delta Group Electronics Inc.; Richard Rumas, Honeywell Canada; James Saunders,Raytheon Company; Patricia Scott, STI Electronics, Inc.; Jose Servin Olivares, Continental Temic SA de CV; Zenaida Valianu, Celestica; Jon Vermillion, Ball Aerospace & Technologies Corp.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a distinguished committee service award.

For their leadership of the 5-22BT Task Group that developed the J-STD-001 Training and Certification Course, Dan Foster, Missile Defense Agency; and Zenaida Valianu, Celestica, earned a committee leadership award. For their significant contribution to the development of the J-STD-001 Training and Certification course, Carol Stirling, EPTAC Corporation, earned a special recognition award. For their contributions, Kevin Boblits, Circuit Technology Inc.; Charles Gamble, NASA Marshall Space Flight Center; Leo Lambert, EPTAC Corporation; and Agnieszka Ozarowski, BAE Systems, earned a distinguished committee service award.

 

For their leadership in the development of the J-STD-001 Training and Certification course for the 5-22B TEU task group, Symon Franklin, Custom Interconnect Ltd.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a committee leadership award. For his contributions, Eric Hinsley, The Electronics Group Ltd., earned a distinguished committee service award.

For their leadership of the 7-31BT Task Group that developed the IPC-A-610G Training and Certification Course, Mary Muller, Crane Aerospace & Electronics; and Helena Pasquito, EPTAC Corporation, earned a committee leadership award. For his significant contribution to the training course, William Graver, NTS – Baltimore, earned a special recognition award. For her contributions, Elizabeth Allison, NTS – Baltimore, earned a distinguished committee service award.

For their contribution to the 5-22BTEU Task Group that developed the IPC-A-610G Training and Certification Course, Symon Franklin, Custom Interconnect Ltd.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a committee leadership award. For his contributions, Rob Mullane, earned a distinguished committee service award.

 

For his leadership of the Process Consumable Statistical Committee, Michael Carano, RBP Chemical Technology, Inc., earned a committee leadership award.

 

For his excellent leadership of the PERM Council in the development of IPC/PERM 2901, Anthony Rafanelli, Raytheon Missile Systems, earned a committee leadership award. For their contributions to IPC/PERM 2901, Martin Anselm, Rochester Institute of Technology; Jelena Bradic, Honeywell Aerospace; Richard Coyle, Nokia; Reza Ghaffarian, Jet Propulsion Laboratory; Ben Gumpert, Lockheed Martin Missiles and Fire Control; David Hillman, Rockwell Collins; Milea Kammer, Honeywell Aerospace; Jeff Kennedy, Celestica; Frank-Peter Kriesch, Diehl Aerospace GmbH; Gary Latta, SAIC; Dale Lee, Plexus Corporation; David Locker, U.S. Army Aviation & Missile Command; Stephen Meschter, BAE Systems; Steven Middleton, Foresite, Inc.; Mick Miller, NSWC – Crane; Andre Oliveira, Embraer; David Pinsky, Raytheon Missile Systems; Jeff Rowe, JR Consulting; Mark Van Solkema, GE Aviation; and Linda Woody, LWC Consulting, earned a distinguished committee service award.

For their leadership of the 5-31j committee in revising IPC-7526A, Mike Bixenman, Kyzen; and Greg Wade, Indium, earned a committee leadership award. For their contributions to IPC-7526A, Dave Adams, Rockwell Collins; Caroline Ehlinger, Rockwell Collins; Jason Keeping, Celestica; Ravi Parthasarathy, Zestron; Doug Pauls, Rockwell Collins; Mark Reimer, Rockwell Collins; Jeff Schake, ASM Assembly Systems; Chrys Shea, Shea Engineering Services; Umut Tosun, Zestron; and Lee Wilmot, TTM Technologies, Inc., earned a distinguished committee service award.

For their leadership of the 5-33aUT subcommittee in the development of White Paper 021, Considerations of New Classes of Coatings for IPC-CC-830C, Doug Pauls, Rockwell Collins; and Amanda Rickman, Raytheon, earned a committee leadership award.

For his leadership of the 7-31H committee in the development of IPC-HDBK 620, a guidance document for those using IPC-WHMA-A-620 and IPC-D-620, Robert Cooke, NASA Johnson Space Center, earned a committee leadership award. For their significant contributions to the completion of IPC-HDBK 620, Gerald Leslie Bogert, Bechtel Plant Machinery Inc.; Bud Bowen, Winchester Electronics Division; Larry Joy, Amptech, Inc; Sean Keating, Amphenol Limited (UK); Theodore Laser, L-3 Communications; John Tinker, Teledyne Reynolds, earned a special recognition award. For their contributions, James Blanche, NASA Marshall Space Flight Center; Constantino Gonzalez, ACME Training & Consulting; Russell Kido, Practical Components Inc.; Garry McGuire, NASA Marshall Space Flight Center; Randy McNutt, Northrop Grumman Aerospace Systems; Bob Potysman, AssembleTronics, LLC.; Erik Quam, Schlumberger Well Services; Richard Rumas, Honeywell Canada; Sharon Ventress, US Army Aviation & Missile Command, earned a distinguished committee service award.

For their leadership of the D-23 subcommittee in the new revision of IPC-4103B, Specifications for Base Materials for High Speed/High Frequency Applications, Ed Sandor, Taconic Advanced Dielectric Division; and Dan Welch, Rogers Corporation, earned a committee leadership award. For their contributions to the standard revision, Mahendra Gandhi, Northrop Grumman Aerospace Systems; Scott Herrmann, Dupont Circleville; Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA); Mamoru (Mark) Takahashi, Asahi Glass Company, Ltd.; Stephen Tisdale, Tisdale Environmental Consulting, LLC.; Chris Totten, Isola Group SARL; Jennet Volden, Rockwell Collins; and David Wynants, Taconic Advanced Dielectric Division, earned a distinguished committee service award.

For their significant contributions to the 2017-2018 IPC APEX EXPO Technical Program Committee, Bev Christian, HDP User Group; Todd MacFadden, Bose Corporation; and Stan Rak, Continental Automotive Systems, earned a special recognition award. For their contributions, Steve Butkovich, Beverley Christian, HDP User Group; Martin Goetz, Northrop Grumman Corp; Dave Hoover, TTM Technologies; Jason Keeping, Celestica; Weifeng Liu, Flextronics; Todd MacFadden, Bose Corporation; Russell Nowland, Nokia; Brook Sandy-Smith, Indium Corporation; Karl Sauter, Oracle America, Inc.; Jeff Schake, ASM Assembly Systems; Julie Silk, Keysight Technologies; Bhanu Sood, NASA Goddard Space Flight Center; and Udo Welzel, Robert Bosch GmbH, earned a distinguished committee service award.

For their leadership of the 2-18b committee that developed IPC-1752A, Amendment 3, Materials Declaration Management Standard, Mark Frimann, Texas Instruments, Inc.; and Aidan Turnbull, BomCheck, earned a committee leadership award. For their significant contributions to this standard, Dr. N Nagaraj, Papros, Inc.; and Jim Kandler, RoHS Ready, LLC, earned a special recognition award. For their contributions, Brenda Baney, B Cubed Consulting; David Carnevale, Dolby Laboratories Forrest Christian, Innovation Machine, Ltd.; Tord Dennis, WSP; Randall Flinders, GreenSoft Technology Inc; Marelle Fogel, DXC; Jason Gooden, Anthesis Group; JB Hollister, Apple, Inc.; Walter Jager, ECD Compliance; Nikki Johnson, Total Parts Plus; Kurk Kan, Bose Corporation; Jim Kandler, RoHS Ready, LLC; Chuck LePard, DXC; Dr. N Nagaraj, Papros, Inc.; Gary Schmalfeld, Raytheon; Eric Straw, Rockwell Collins; Jean-Pierre Theret, Dassault Systemes; Bryan Tran, LSI Logic Corporation; James Vetro, GE Healthcare; Larisa Vishkovetsky, Seagate Technology; Bakul Wadgoankar, Bose Corporation, Tedie West, Siemens; Michael Wurzman, RSJ Technical Consulting; and Michael Zepp, Dassault Systemes, earned a distinguished committee service award.

For their leadership of the 2-18j committee in the development of IPC-1753, Amendment 1, Laboratory Report Standard, Jason Gooden, Anthesis Group; and JB Hollister, Apple, Inc., earned a committee leadership award. For their contributions to IPC-1753, Emma Gates, Intel Corporation; William Haas, Jim Kandler, RoHS Ready, LLC.; Valerie Kuntz, Assent Compliance, Inc.; Chuck LePard, DXC; Dr. N Nagaraj, Papros, Inc.; Stacy Stannard, Bureau Veritas Consumer Products Services; Jean-Pierre Theret, Dassault Systemes; Stephen Tisdale, Tisdale Environmental Consulting, LLC.; Aidan Turnbull, BomCheck; Larisa Vishkovetsky, Seagate Technology; Bakul Wadgaonkar, Bose Corporation; Tedie West, Siemens; Michael Wurzman, RSJ Technical Consulting; Michael Zepp, Dassault Systemes, earned a distinguished committee service award.

For leadership of the D-13 Flexible Circuits Base Materials Subcommittee in the new revision of IPC-4202B, Flexible Base Dielectrics for Use in Flexible Printed Boards, Clark Webster, ALL Flex, LLC., earned a committee leadership award. For their contributions, Michael Collier, Teledyne Advanced Dielectric Solutions; Mark Finstad, Flexible Circuit Technologies, Inc.; Thomas Gardeski, Gemini Sciences, LLC.; Scott Herrmann, Dupont Circleville; Michael Jawitz, Orbital ATK; Nick Koop, TTM Technologies; John Leschisin, Minco Products, Inc.; Mark Seelhammer, Rogers Corporation; Terry Fischer, Hitachi Chemical Company America, Ltd.; Rebecca Steinbauer, ALL Flex, LLC.; and Brent Sweitzer, Multek Flexible Circuits, Inc., earned a distinguished committee service award.

For their leadership of the 5-24c Solder Alloy Task Group that developed Amendment 1 to J-STD-006C, Dave Adams, Rockwell Collins; and Jennie Hwang, H-Technologies Group, earned a committee leadership award. For their contributions, Mahendra Gandhi, Northrop Grumman Aerospace Systems; Renee Michalkiewicz, NTS – Baltimore; Tetsuro Nishimura, Nihon Superior Co., Ltd.; and Brook Sandy-Smith, Indium Corporation, earned a distinguished committee service award.

For their contributions to Printed Electronics standards, Leonard Allison, NTS – Baltimore; Sai Avuthu, Jabil Circuit, Inc.; Neil Bolding, MacDermid Enthone Electronics Solutions; Alan Brown, Engineered Materials Systems, Inc.; Alan Burk, ALMAX; Ken Gann, Lab Tech; Mary Alice Gill, Jabil Circuit, Inc.; Josh Goldberg, Taiyo America Inc.; Scott Gordon, DuPont Teijin Films; Mary Herndon, Raytheon Company; Mike Mastropietro, NextFlex; Jeffrey Parker, Insulectro; Haridoss Sarma, GO 2 Scout 4 R&T; Paul Shaw, In2Tec; Jeff Shubrooks, Raytheon Company; Richard Snogren, Bristlecone, LLC.; Hector Valladares, Honeywell Aerospace; and Steve Vetter, NSWC Crane, earned a distinguished committee service award.

For his leadership of the 7-24 subcommittee that developed IPC-9121 Amendment 1, Michael Carano, RBP Chemical Technology, Inc., earned a committee leadership award. For their contributions, Paul Cooke, TTM Technologies; Happy Holden; and Bhanu Sood, NASA Goddard Space Flight Center, earned a distinguished committee service award.

For his leadership in the development of IPC-7095D, Ray Prasad, Ray Prasad Consultancy Group; and Rob Rowland, Axiom Electronics, LLC., earned a committee leadership award. For their contributions, Dudi Amir, Intel Corporation; Raiyomond Aspandiar, Intel Corporation; Ife Hsu, Intel Corporation; Karen McConnell, Northrop Grumman Corporation; Bhanu Sood, NASA Goddard Space Flight Center; John Thompson, FCI USA, Inc., earned a distinguished committee service award.