PCBA Cleanliness End-of-Project Webinar Two Sessions Scheduled — October 8
iNEMI’s PCBA Cleanliness project looked at the impact of cleanliness on PCBAs with bottom-terminated components (BTCs). Using single-row QFN component packages as a representative example of a BTC on a multi-quadrant test board, the team utilized clean and no-clean solder pastes and conducted various levels of cleaning (no-clean, water clean and solvent clean). This was followed by surface insulation resistance (SIR), ion chromatography (IC) and other testing to determine the trade-offs between electrical performance, ionic contamination levels, and cleanliness.
Join the PCBA Cleanliness project team to review the results of their work. Two sessions are scheduled, and the webinar is open to members and non-members. Registration is required.
For more information, please contact Mark Schaffer (marks@inemi.org).
Session 1 (APAC)
Tuesday, October 8, 2019
10:00-11:00 a.m. JST (Japan) / 9:00-10:00 a.m. CST (China)
Register now
Session 2 (EMEA and Americas)
Tuesday, October 8, 2019
11:00 a.m. — noon. EDT (US) / 5:00-6:00 p.m. CEST (Europe)
Register now
Upcoming iNEMI Meetings
Don’t forget about the following webinars, workshop sessions and meetings:
- Warpage Characteristics of Organic Packages end-of-project webinar (September 18 & 20)
- iNEMI PCB & Laminate Technology Integration Group (TIG) meeting (iNEMI members only; September 18)
- iNEMI Member Meeting at SMTA International 2019 (members only; September 14)
- iNEMI presentations at SMTA International (September 26)
- iNEMI/IMAPS special session on design and test challenges of SiP and advanced packages, held at iMAPS International Symposium on Microelectronics (October 1)
