SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Under harsh environmental conditions like corrosion, radiation, high temperature and vibration, the aging of components is drastically accelerated. Dr. Kirsten Weide-Zaage of the University of Hannover will present on strategies for the identification of failure mechanisms and their interactions, test structure, test method development, specification and validation.

High failure rates are common when electronic systems are placed in harsh environments. Failed solder joints can occur from oxidation on component terminations. Tony Boswell of Retronix Limited will present on preparing ICs and Components so they will survive when placed in harsh environments.

As the demand for high interconnect solutions at the circuit board level increase, there must be performance improvements in components, interconnects and substrates. Martin Wickham of NPL will present research on coating systems for organic PCBs that are designed to operate at 250°C. The research finds that there is a reduction in oxidation rates to exposed metals in both the inner and outer layers within multilayer structures.

Alternative solder alloys designed for higher temperatures are needed. Mathias Nowottnick of the University of Rostock will present on transient liquid phase sintering research by combining solid copper powder and liquidus SnAgCu solder. This novel intermetallic has a melting point of 415°C. This research finds that transient liquid phase sintering can be used to develop high temperature alloys that work at higher temperatures. This contribution will show examples for manufacturing, achievable properties and possible applications.