SHENMAO PF606-P245 improves ICT testability with flux completely removed from top of solder to prevent contamination of Test Pins during Test operation. Minimal Flux Residue gathers near outside of Solder Joint on the PCB Substrate, a substantial improvement over legacy solder Paste.

For more than 44 years, SHENMAO has been dedicated to produce Solder Products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preform, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

SHENMAO Solder Materials are available at affordable cost from 10 worldwide locations.