WHITE PAPER - Understencil Wipe Cleaning Yields Improvements
By Brook Sandy-Smith, Indium Corporation; Mike Bixenman, D.B.A., Kyzen, Nashville, TN; Chrys Shea, Chrys Shea Engineering Services, Burlington, NJ; and Ray Whittier, Vicor Corporation - VI Chip Division, Andover, MA.
Jun 04, 2014
Understencil wiping has gained growing interest over the last several years. Due to the use of ever smaller components and increasingly dense interconnections in the design of printed-circuit boards (PCBs), stencil cleanliness is more important than ever, both inside the aperture wall and on the seating surface of the stencil. In most stencil printing processes, dry wiping the stencil’s bottom side has been followed by vacuum assist in an effort to remove excess solder paste from the aperture walls. As stencil apertures shrink in size, more frequent wiping is needed to assure that stencils are free of excess solder paste that can hamper their process performance.
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