WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability
By Brook Sandy-Smith, Indium Corporation and Joe Perault, PARMI USA
May 07, 2014
Miniaturization is an unrelenting force in the electronics industry. Components continue to get smaller and smaller, requiring even tinier solder paste deposits for assembly. This is a challenge for solder paste printing processes and material selections, and now we are reaching sizes that require further capabilities for analysis. A crucial step to assembling reliable PCBs is inline paste inspection.
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