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WHITE PAPER - Optimizing Reflow Profile Via Defect Mechanisms Analysis

By Dr. Ning-Cheng Lee

Apr 04, 2014

The reflow profile is engineered to optimize soldering performance based on defect mechanisms analysis. In general, a slow ramp-up rate is desired in order to minimize hot slump, bridging, tombstoning, skewing, wicking, opens, solder beading, solder balling, and components cracking.

Download White Paper Here





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