Täby, February, 2018 – Mycronic AB (publ) will demonstrate its growing range of next-generation line automation, dispensing and inspection solutions for just-in-time electronic assembly at IPC APEX EXPO 2018 in San Diego (Booth 3511, Feb. 27 – March 1). Inspection solutions became part of the product portfolio with the acquisition of Vi TECHNOLOGY. Vi TECHNOLOGY, with headquarters in France, is a leading provider of 3D optical inspection solutions. By combining next-generation 3D inspection with its latest product pick-and-place and jet dispensing platforms, Mycronic can now offer the most complete solution for tomorrow’s intelligent factory.

Growing range of solutions on display

Products on display at APEX 2018 will include the new MY300 pick-and-place solution, MY700 high-speed jet printer for solder paste and assembly fluids, 3D inspection systems, a new higher-capacity small-footprint storage tower as well as versatile dispensing and conformal coating equipment.

Automating for tomorrow – today

“Our ambition is to deliver complete, robust and intelligent software-driven automation solutions for the smart factories of today and tomorrow,” says Thomas Stetter, Sr VP General Manager Assembly Solutions. “Our R&D efforts are aimed at improving virtually every stage of fully automated in-line assembly. This means customers can rest assured they’ve got future-proof solutions to meet the trend towards extensive product mixes, shorter series production and product life cycles, as well as smaller components and increasingly complex circuit boards.”

The fully automated MYPro series production line

For the highest levels of SMT automation, Mycronic is introducing its next-generation MYPro series production line. Completely software-driven and operator-independent, the MYPro series combines comprehensive factory connectivity and real-time data into a single, fully automated production solution. The MYPro production solution comprises:

  •  MY700 jet printer and dispenser, which jets both solder paste and a wide range of adhesive and assembly fluids at the industry’s highest speeds.
  •  MY300 pick-and-place machines, which deliver higher real speeds and expanded feeder capacity within a 40% smaller machine footprint than previous generations.

MY700 – Solder paste and adhesive jetting with twice the possibilities

The MY700 combines a new dual-lane, dual-head design with high-speed, state-of-the-art jetting heads. The dual-head design covers the widest possible range of solder paste dot volumes for small and very large components, or can be configured to jet two different types of media. The machine’s dual-lane capability ensures a non-stop flow of multiple boards with no operator intervention.

MY300 – Higher productivity with a 40% smaller footprint

The new MY300, available in three models, expands capacity up to 224 feeder positions within a 40% smaller footprint than previous models. Higher real speed is enabled due to a number of performance enhancements including automatic conveyor width and job selection, as well as faster tool changes, which occur while the other head is mounting. Fully automated board train functionality is now standard, significantly increasing throughput due to simultaneous loading and unloading of multiple boards.

SMT line solution extended with next generation 3D inspection systems

“Our recent acquisition of Vi TECHNOLOGY allows Mycronic to extend its product offering of advanced SMT production equipment to include a portfolio of next generation 3D inspection systems and process improvement software,” says Thomas Stetter. He notes that the new inspection system will include the PI series for 3D solder paste inspection (SPI), the K series for 3D automated optical inspection of circuit boards (AOI) as well as the ground-breaking software suite SIGMA Link.

New higher-capacity SMD Tower 8000 storage system

To help assemblers cope with tighter floor space constraints and a need for increasingly efficient component storage, Mycronic will also unveil its latest near-production storage system called the SMD Tower 8000. The new unit is taller than previous models and allows for a 17% increase in feeder capacity in the same footprint. The new tower provides an automatic, highly efficient cassette-free component retrieval system close to the production line for quick and smooth changeovers.

New MYSmart series for dispensing and coating

Finally, with the MYSmart series, Mycronic has significantly expanded its capabilities to become one of the world’s largest suppliers of advanced dispensing and conformal coating equipment for the electronics industry. At APEX, Mycronic will exhibit a range of new MYSmart series solutions, including compact tabletop dispensers, versatile conformal coating systems and in-line dispensing equipment. The expanded product portfolio provides manufacturers with a wide selection of cost-efficient solutions for enhanced control of dispense precision, coating area and thickness, process speed, and more.

To view the new MYPro series and MYSmart series, and to explore the advantages of Mycronic’s advanced automation solutions, next generation 3D solder paste inspection systems and improved SMD Tower 8000 storage system, visit Booth 3511 at 2018 IPC APEX EXPO in San Diego on February 27 – March 1, 2018. Visitors interested in the complete range of state-of-the art 3D inspection technology are welcome to visit Vi TECHNOLOGY at Booth 3707, which is located next to the Mycronic booth.