Mycronic AB (publ) will demonstrate its latest generation of assembly solutions for the intelligent factory at Productronica 2017 in Munich, November 14-17, 2017. Products on display will include the new MY300 pick-and-place solution, the new MY700 for high-speed jet printing of solder paste and jet dispensing of assembly fluids, next generation 3D inspection systems and a range of new dispensing and conformal coating equipment.
The fully automated MYPro series production line
To help manufacturers achieve the highest levels in SMT automation, Mycronic is introducing its next-generation MYPro series production line. Completely software-driven and operator-independent, the MYPro series combines comprehensive factory connectivity and real-time data into a single, fully automated production solution. Intelligent features include full visibility planning, automated material handling, advanced traceability and production statistics, among many others. The line comprises two MYPro series production platforms:
– MYPro series MY300 pick-and-place machines, which deliver higher real speeds and expanded feeder capacity within a 40% smaller machine footprint than previous generations.
– MYPro series MY700 jet printer and dispenser, which jets both solder paste and a wide range of adhesive and assembly fluids at the industry’s highest speeds.
MY300 – Higher productivity within a 40% smaller footprint
The new MY300 expands capacity up to 224 feeder positions within a 40 percent smaller footprint than previous models. At the same time, it achieves higher real speeds due to a number of performance enhancements including automatic conveyor width and job selection, as well as faster tool changes, which take place while the other head is mounting. Fully automated board train functionality is now standard, which significantly increases throughput thanks to simultaneous loading and unloading of multiple boards. The MY300 is available in three different models, offering a wide selection of highly automated line configurations for any intelligent factory.
MY700 – Solder paste and adhesive jetting with twice the possibilities
The MY700 combines a new dual-lane, dual-head design with high-speed, state-of-the-art jetting heads. The dual-head design covers the widest possible range of solder paste dot volumes for small and very large components, or can be configured to jet two different types of media. The machine’s dual-lane capability ensures a non-stop flow of multiple boards with no operator intervention. With just one fully software-driven machine, the MY700 makes it possible to cover a wide variety of challenging process steps with no need for screen printers or general dispensers, all within just one-and-a-half square meters of floor space.
SMT line solution extended with next generation 3D inspection systems
With the recent acquisition of Vi TECHNOLOGY Mycronic has extended its product offering of advanced SMT production equipment to include a portfolio of next generation 3D inspection systems and process improvement software. The new inspection systems include the PI series for 3D solder paste inspection (SPI), the K series for 3D automated optical inspection of circuit boards (AOI) as well as
the ground-breaking software suite SIGMA Link.
New MYSmart series for dispensing and coating
With the MYSmart series, Mycronic has significantly expanded its capabilities to become one of the world’s largest suppliers of advanced dispensing and conformal coating equipment for the electronics industry. At Productronica, Mycronic will exhibit a range of new MYSmart series solutions, including compact tabletop dispensers, versatile conformal coating systems and in-line dispensing equipment. The expanded product portfolio provides manufacturers a wide selection of cost-efficient solutions for enhanced control of dispense precision, coating area and thickness, process speed, and more.
To view the new MYPro series and MYSmart series, and to explore the advantages of Mycronic’s advanced automation solutions and next generation 3D solder paste inspection systems, visit booth A3.341 at Productronica 2017 in Munich, November 14-17, 2017. Visitors interested in the complete range of state-of-the art 3D inspection technology are welcome to visit Vi TECHNOLOGY’s booth A2.421.