ITASCA, IL — March, 2018. Kester is proud to announce the launch of NP560, a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has
redefined the voiding standard for PCB assembly and has the potential for low voiding
performance.

For additional information on this product including technical and safety data sheets,
please visit https://www.kester.com/products/product/np560-solder-paste.