NASHVILLE — March 2018 — KYZEN today announced that Mike Bixenman, DBA, will present at the SMTA Electronics in Harsh Environments Conference, scheduled to take place April 24-26, 2018 at the Crowne Plaza Amsterdam.

The conference is focused on building reliable electronics that operate within harsh environments. Dr. Bixenman will present “Materials Characterization under Leadless Component Bodies”, and will discuss the results from his research to qualify and validate assembly processes as it relates to materials and cleaning using alternative test board design features to determine the risk of failure.

“This conference is a great resource for engineers of all levels,” explained Mike Bixenman. “Materials in electronics packaging continue to evolve in response to complex manufacturing and reliability requirements, particularly those that must work within aggressive operating environments.”

Experts from industry and academia will present on topics including predicting component life, solder alloys that can withstand high operating temperatures, test methods for harsh environments, electrochemical reliability and coatings. Miniaturization and environment play major roles in the electronics lifecycle. The failure mechanisms for SAC solder joints, LEDs and Electrochemical Migration will be studied and reviewed, with particular attention paid to the automotive end-use environment.

Dr. Mike Bixenman has more than 25 years of experience in the design of electronic assembly cleaning materials and process integration. He has held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.