February, 2018 ZESTRON, a provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Jet Printed Solder Paste and Cleaning Challenges” at the IPC APEX 2018 in San Diego, CA.
Recent evidence has shown that it is becoming extremely challenging to consistently deliver the correct amount of solder using the screen printing process. More and more manufacturers in today’s production environment are overcoming this challenge by incorporating jet printing as an additional add-on step to add extra solder paste volume to solve such challenges. Solder paste jetting offers the flexibility to deposit the right amount of solder paste volume on the boards that have both miniature and large size components that need to be soldered adjacent to each other.
Anecdotal evidence with current industry companies indicates that as solder powder becomes finer, the resulting flux residues become more difficult to remove. This presentation is part of an initial study executed specifically on jet printing (Type 5) solder pastes using multiple cleaning agents in both spray-in-air inline and batch cleaning systems. The results are further validated by several industry case studies.
Ravi Parthasarathy will present during the Cleaning session on Wednesday, February 18, from 1:30 PM to 3:00 PM. For more information, please visit www.ipcapexexpo.org.