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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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Intel CEO Brian Krzanich to Keynote at 2015 International CES
Oct 24, 2014 - Krzanich returns to keynote stage to discuss Intel’s vision for how technology will continue to shape our lives
IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference to Present Data on Process Enhancement and Control
Oct 24, 2014 - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
2015 International CES to Feature Latest Innovations in Lifestyle Technologies
Oct 23, 2014 - Lifestyle-focused conferences and exhibits produced by Living in Digital Times to highlight technology advancements in education, family connectivity, the aging population, wearable tech and fashion, fitness and health
Gartner Says IT Managers Can Cut Colocation Costs in Europe by Moving North
Oct 23, 2014 - Analysts Will Explore Data Centre Strategies in More Detail at the Gartner Data Center, Infrastructure & Operations Management Summit 2014, November 24-25 in London
News Publishing
Amtech to acquire BTU International in an all stock transaction
Keithley Provides Full Wafer-Level Support Including High Voltage Capacitance-Voltage Testing for Its Parametric Curve Tracer Configurations
Keysight Technologies to Demonstrate Hardware and Electronic Design Automation Software Solutions at EPEPS 2014
LPKF Adjusts Forecast for 2014
Sensor System Accurately Monitors Material Level in Pressurized Reservoirs
The Selective Soldering Academy (SSA) Next Sessions
The Third Generation Prism coating system platform has new options for medical device coating

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North American PCB industry outlook brightens


What is a PCB Design "Floorplan"?;

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The Internet of Things: Propelling Smart Cities
Full Story

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Deliver Best Practices: Importance of LEAN in Driving Innovation

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New at the 2015 CES: Personal Privacy and Cyber Security Marketplaces view

Session Two of the IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference to Focus on Ultra-Thin and Nano-Coatings
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Industry 4.0: It’s not too late to jump on board view

Solar PV Growth Rates Grab Headlines But Shipment Volumes Remain the Ultimate Goal
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News From the EIPC - October
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Don’t Talk About Industry 4.0! Resistance To Change Is Futile

In Conversation
Rob DiMatteo, Regional Sales Manager, BTU International at SMTAI 2014 view

Pete Ruth, North American Business Manager, Conecsus at SMTAI 2014
EMS People
Brian Smith and Jeff Timms of ASM Assembly Systems at SMTAI 2014 view

Coco Zhang of BTU International at NEPCON South China

A Welcome and Honest New Book on Outsourcing the Supply Chain view

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Preservative-free Diodes and Non-GMO Capacitors


Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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