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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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IDC Manufacturing Insights Shines Spotlight on Current Application of Big Data Analytics Across Manufacturing Segments
Jul 23, 2014 - New research to help manufacturers leverage BDA effectively to maximize impact on organization
SEMI Announces New South America Semiconductor Strategy Summit
Jul 23, 2014 - SEMI has announced the launch of the association's first-ever event in Latin America. The inaugural SEMI South America Semiconductor Strategy Summit will be held November 18-20, 2014, at the Hilton Buenos Aires in Buenos Aires, Argentina.
Are International Development and Funding Agencies Helping Take Kenya to the ICT Tipping Point?
Jul 22, 2014 - ICT has assumed an increasingly strategic role in the Kenyan economy in recent years. Between 2000 and 2012, the country's wider transport and communications sector, of which ICT is a part, grew at a compound annual growth rate (CAGR) of 7.7%
The Asia/Pacific PC Market Comes in Close to Expectations in Q2 2014, Reports IDC
Jul 22, 2014 - IDC's preliminary results show that the Asia/Pacific (excluding Japan) PC market increased 2% from last quarter and declined 10% year-on-year in Q2 2014 to reach 24.3 million units, coming in marginally higher than IDC's initial forecasts.
News Publishing
5% Tolerance Thick Film Chip Resistor Sample Kits from Stackpole
ADLINK Releases SMARC Module LEC-BT Running Intel® Atom™ Processor E3800 Series System-on-Chip
Camtek Schedules Second Quarter 2014 Results Release and Conference Call for Tuesday, July 29, 2014
CPO Commerce Celebrates its 10-Year Anniversary
GreenPeak Technologies’ Smart Home chips support new networking protocols like Thread
Kirby & Demarest to Represent Akrometrix LLC in the Pacific Northwest

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Smartphone Charging to Consume Almost 14,000 Gigawatt-hours of Dirty Energy by 2019. view

MANA Research: A cool approach to flexible electronics
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Greater Automation of Testing Will Help Flexible and Rigid Electronic Manufacturers Improve Product Quality and Decrease Costs
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WHITE PAPER - Voiding Reduction in Bottom Terminated Components (BTC) with Improved Flux Coating

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The Dawning Resurgence of a Mexican Outsourced Manufacturing Model
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New IPC Group Focuses on Inexpensive Protection Technologies for Electronic Assemblies

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CEA Announces International CES Asia to Serve as Premier Asian Event

Power and High Temperature Electronics Experience at SMTA International
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Nanotechnology Researchers Replace Solder with Water


Top-5 PV Countries Account for 80% of Global PV Demand

EMS People
Wolfgang Mueller, ASYS at SMT 2014 view

Rob Raine, DEK at SMT 2014

Order of Protection: People, Planet, then Product? view

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Keep the Pressure on Electronics-Industry Associations

In Conversation
Rick Goldsmith, DEK at SMT 2014 view

Mark Stansfield, SolderStar at SMT 2014

Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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