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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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DSG receives 2014 “Supplier of the Year” Award from Honeywell Aerospace
Oct 17, 2014 - Dongguan Somacis Graphic PCB Co. Ltd. (DSG) has received the 2014 Supplier of the Year Award in recognition of the service and delivery performance at the 2014 Honeywell Aerospace Supplier Summit Electrical Sourcing
Flextronics Wins Top Supply Chain Innovation Award at CSCMP Conference
Oct 17, 2014 - Flextronics (NASDAQ: FLEX) won the first-place award in the 2014 Supply Chain Innovation Award™ competition at the Council of Supply Chain Management Professionals' (CSCMP) Annual Global Conference held recently in San Antonio, Texas, USA.
Albert Theuwissen of Harvest Imaging Honored with European SEMI Award 2014
Oct 16, 2014 - Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.
Samsung Invests Big to Maintain Leadership, Support New Markets
Oct 16, 2014 - Leadership in smartphones, Smart TVs, and tablet PCs spurs big investment in new IC fab
News Publishing
Ellsworth Adhesives Awarded Dow Corning’s Gold Level Distributor of the Year
EMC Recognizes Celestica with Second Consecutive Supplier of the Year Award
ERSASCOPE 2 Is the Only Optical Inspection System for Flip Chips and CSPs
Intertronics introduce the new BlueWave® Fast Cure UV LED Flood System
Metcal Will Exhibit Fume Extractors and Convection Rework Systems at SMTA LA/Orange County
The Open Day organized by LACROIX Electronics was a success

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Session Two of the IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference to Focus on Ultra-Thin and Nano-Coatings view

Daimler Chairman Dr. Dieter Zetsche to Deliver Keynote Address at 2015 CES
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Solar PV Growth Rates Grab Headlines But Shipment Volumes Remain the Ultimate Goal view

“Where in the World..?”… Global Footprint Decisions are Too Critical to Base on Anecdotes Alone
In Conversation
Rob DiMatteo, Regional Sales Manager, BTU International at SMTAI 2014 view

Pete Ruth, North American Business Manager, Conecsus at SMTAI 2014
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Deliver Best Practices: Importance of LEAN in Driving Innovation
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Teens and Tech: A Growing Market for Wearables

EMS People
Brian Smith and Jeff Timms of ASM Assembly Systems at SMTAI 2014 view

Coco Zhang of BTU International at NEPCON South China
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What is a PCB Design "Floorplan"?


IPC Study Examines Potential Spots for Global Expansion/font>

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Don’t Talk About Industry 4.0! Resistance To Change Is Futile
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Launching An Outsourced PCB Layout Project

A Welcome and Honest New Book on Outsourcing the Supply Chain view

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Preservative-free Diodes and Non-GMO Capacitors


Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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