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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis


Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields


How to better manage the complexity of LED binning with Valor


Optimizing Assembly of QFNs


Best Practice NPI, improve your return on investment


Reliability Challenges for Bottom Termination Components


Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs


Extreme Production Planning


 

 

 


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News Publishing
Audi’s Rupert Stadler to Keynote Inaugural International CES Asia
Oct 31, 2014 - CES Asia to Feature Top Global Brands Including Audi, Ford, Hisense, IBM and Monster
Pan Pacific Microelectronics Symposium Program Finalized
Oct 31, 2014 - SMTA announced that the program is finalized for the 20th Annual Pan Pacific Microelectronics Symposium. The event will take place February 2-5, 2015 at the Sheraton Kauai Resort on Kauai, Hawaii.
SEMICON Japan 2014: New Venue and New Ideas for Rebounding Industry
Oct 30, 2014 - SEMI has announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.
Worldwide Smartphone Shipments Increase 25.2% in the Third Quarter with Heightened Competition and Growth Beyond Samsung and Apple, Says IDC
Oct 30, 2014 - New smartphone releases and an increased emphasis on emerging markets drove global smartphone shipments above 300 million units for the second consecutive quarter.
News Publishing
Advanced MP Technology Opens New Office in France
Electrolube to launch New Coating and Resin Products at EFY Expo India
Engineered Material Systems Sponsors Back Contact Workshop
Kurtz Ersa Offers the Industry’s Most Demanded Selective Solder Platform
KYZEN Experts Presenting Latest Processes at the High-Reliability Cleaning and Conformal Coating Conference
LACROIX Electronics awarded by the Polish Masters of Business contest
Optimum Design Installs Universal Instruments Fuzion SMT Line
Peter Koch of Nordson DAGE Will Discuss Failure Analysis with X-ray at Etek’s Technology Event
Techcon Systems Selects Representative for Central Mexico
Wave Soldering Applications of Thick PCBs Made Easier with ALPHA® EF-8800HF Solder Flux










 
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Wearable Sensors: Technology Trends and Challenges view

Experts to Discuss Bottom Termination Components during the IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference
EMS People
Bob Black, President & CEO, Juki Automation Systems at SMTAI 2014 view

Brian Smith and Jeff Timms of ASM Assembly Systems at SMTAI 2014
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How to Place Breakaway Rails in a PCB Design
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News From the EIPC - October

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North American PCB industry outlook brightens


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What is a PCB Design "Floorplan"?;

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The Internet of Things: Propelling Smart Cities
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Industry 4.0: It’s not too late to jump on board view

Solar PV Growth Rates Grab Headlines But Shipment Volumes Remain the Ultimate Goal
In Conversation
Rob DiMatteo, Regional Sales Manager, BTU International at SMTAI 2014 view

Pete Ruth, North American Business Manager, Conecsus at SMTAI 2014

A Welcome and Honest New Book on Outsourcing the Supply Chain view

Previous Column:
Preservative-free Diodes and Non-GMO Capacitors

 

Assembleon, Asymtek, Mydata, Siemens, Transition Automation
 





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